Oxidation is part of the wafer bonding process
and can also be provided as a service for standard Si.
and can also be provided as a service for standard Si.
Wafers can be produced with a specific oxide thickness
Thickness Range - 500 to 40,000 Angstroms
Tolerance of +/-5%
Thickness Range - 500 to 40,000 Angstroms
Tolerance of +/-5%
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| Semiconductor Processing Company 12 Channel Street #702 Boston, MA 02210 Voice (617) 345-9936 FAX (617) 345-9271 |